Heat conductive paste NT / NP
Heat conductive paste for cooling driver IC
Product Features
- This is the silicone-free and solventless type thermal conductive paste with high fluidity, applicable to overmold thermal-radiating device without bubbles, by its excellent heat release property and reliability. It is a fluid type applicable to flexible substrate.
- Product name
- Heat conductive paste NT / NP
- Product Applications
- Industry and manufacturing
