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Sekisui presented exhibits at 10th IC Packaging Technology Expo
Feb 9, 2009
The Fine Chemicals Division and New Business Promotion Division of the High Performance Plastics Company presented exhibits at the 10th IC Packaging Technology Expo held at Tokyo Big Sight from January 28th (Wednesday) to 30th (Friday).

Despite the sudden downturn in the semiconductor market starting in the second half of last year, the Expo and concurrent shows were attended by a total of approximately 60,000 visitors including 790 attendees visiting the Sekisui Chemical booth, a significant increase over last year's figures.

With "Total Solutions for Cutting-edge Semiconductor Packaging" as the key phrase, a total of eight products and technologies were exhibited from the fine-particle products (Micropearl AU, etc.) and functional adhesives groups (late curing paste, etc.). Enquiries were received from numerous customers for existing products as well as for new products exhibited for the first time such as self-release paste and 1-second curing paste, making this a truly worthwhile exhibition.

We extend our deepest thanks to all those who visited our booth during the exposition and to those who extended their collaboration in the realization of this exhibition.

Overall view of exhibition booth Scene at the busy booth
Overall view of exhibition booth
Scene at the busy booth

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This press release may contain forward-looking statements. Such forward-looking statements are based on current expectations and beliefs and are subject to a number of factors and uncertainties that could cause actual results to differ materially from those expressed or implied by such statements due to changes in global economic, business, competitive market and regulatory factors.
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