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Press Release

February 6, 2008
SEKISUI CHEMICAL CO., LTD.

Sekisui Chemical Products Exhibited
at "9th IC Packaging Technology Expo," 1/16 - 18.

The High Performance Plastics Company together with the P2 Business Department exhibited products at the 9th IC Packaging Technology Expo from January 16th (Wednesday) to 18th (Friday). The Expo and concurrent shows were attended by a total of approximately 55,000 visitors, many of whom visited the Sekisui Chemical booth.

♦ High Performance Plastics Company

The High Performance Plastics Company exhibited 9 products (Tape, fine particles, etc.) that will bring a breakthrough in the field of high-density IC packaging processing from the Industrial Tape Division (Selfa BG, DC), the Fine Chemicals Division (Micropearl AU, etc.) and the Research and Development Institute (SOL, DAF, etc.).

Approximately half of the visitors to the booth approached staff for explanations and descriptions of products, making this a productive show that will enhance the presence of Sekisui Chemical in the field of semiconductors.




♦ P2 Business Department

The P2 Business Department introduced its newly-developed high-performance remote processing and atmospheric pressure plasma surface treatment systems for film. Proposals for new applications such as ashing and residue removal won high acclaim from many of the visitors.

We would like to take this opportunity to express our thanks for the many opinions and comments offered by visitors to our booth.




Press Contact

SEKISUI CHEMICAL CO., LTD.
Corporate Communication Department
Fax: (+81) 3-5521-0510

Disclaimer

This press release may contain forward-looking statements. Such forward-looking statements are based on current expectations and beliefs and are subject to a number of factors and uncertainties that could cause actual results to differ materially from those expressed or implied by such statements due to changes in global economic, business, competitive market and regulatory factors.

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