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TOP > About SEKISUI > What's New Archive > What's New (March 4, 2008)
SEKISUI

About SEKISUI What's New

Event

March 4, 2008
SEKISUI CHEMICAL CO., LTD.

The High Performance Plastics Company's Industrial Tape Division holds a PCB/FPC seminar in Suzhou, China

On Friday, February 22, the Industrial Tape Division held an explanatory meeting on products related to printed circuit boards (PCBs) and flexible printed circuits (FPCs) in Suzhou, China (at the Shangri-La Hotel).

The seminar featured a presentation on the latest trends in the PCB industry from Vice-President Yan of the China Printed Circuit Association (CPCA).

Following this presentation, the "Tackwell" line of protection tape for photo masks used in the PCB manufacturing process and "RP mold film" used in the FPC manufacturing process were introduced. This seminar featured public-relations activities focused mainly on new products in both of these areas.

The seminar welcomed more than 100 users from 35 companies, and the reception held in the evening was utilized for the exchange of large volumes of information.

Today, "Tackwell" boasts the top market share in the Huadong region (East China), at more than 60 percent. In addition, the market share of "RP film," developed at NBO and sold overseas by the Industrial Tape Division, is growing its share in this region, having reached a current level of more than 30 percent.

In the future as well, plans call for deployment of sales activities and technical services firmly rooted in local markets, based on the theme of achieving and maintaining the "top market share in the region."



A scene from the seminar

Press Contact

SEKISUI CHEMICAL CO., LTD.
Corporate Communication Department
Fax: (+81) 3-5521-0510

Disclaimer

This press release may contain forward-looking statements. Such forward-looking statements are based on current expectations and beliefs and are subject to a number of factors and uncertainties that could cause actual results to differ materially from those expressed or implied by such statements due to changes in global economic, business, competitive market and regulatory factors.

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